Introduction of the keynote speakers

Tadatomo Suga

Tadatomo Suga, Professor Emeritus of the University of Tokyo, Executive Chief Researcher at MeiseiUniversity, Executive Director of Institute for Advanced MicroSytem Integration (IMSI). His research focuses on microelectronics and microsystems packaging, particularly on developing critical technologies related to low-temperature bonding and interconnects, with special emphasis on Surface Activated Bonding (SAB).

Yue Hao（郝跃）

Yue Hao, Academician of the Chinese Academy of Sciences, Professor of Xi'an University of Electronic Science and Technology.He obtained his PhD in Computational Mathematics from Xi'an Jiaotong University in 1991. He has long been engaged in scientific research and talent cultivation in the fields of new wide bandgap semiconductor devices and materials, as well as new micro nano semiconductor devices and materials.

Sheng Liu（刘胜）

Sheng Liu, Academician of the Chinese Academy of Sciences, European Academy of Science and Arts, Austria, IEEE Fellow, ASME Fellow, Professor at Wuhan University. His main research areas are process mechanics in microelectronics, optoelectronics LED, MEMS, Application in power electronics and other fields, wide bandgap semiconductor growth online real-time monitoring scientific device, MEMS/NEMS, LED, System packaging and integration, reliability.

Takehito Shimatsu

Takehito Shimatsu, Professorof Frontier Research Institute for Interdisciplinary Sciences andResearch Institute of Electrical Communication, Tohoku University. His research specialties include room temperature bonding using inorganic thin films (Atomic Diffusion Bonding), and material science for magnetic storage devices.

Jin Kang（康劲）

Jin Kang, Ph.D., the General Manager of Northern Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd. is responsible for promoting and implementing the construction of the Innovation Center's four major platforms: R&D validation platform, advanced process development flow platform, scientific research experiment platform, and industry education integration talent training platform.

Chengkuo Lee（李正国）

Chengkuo Lee, Director of Center for Intelligent Sensors and MEMS at the National University of Singapore. His main research fields involve optical infrared microelectromechanical systems for consumer applications and environmental monitoring; microfluidics and lab-on-a- chip, etc. He has published more than 500 high-impact publications, including in Nature, Nature Photonics, Nature Communications, Science Advances, ACS Nano.

KevinChen Jing（陈敬）

Kevin Chen Jing, IEEE Fellow and Chair Professor at The Hong Kong University of Science and Technology (HKUST), serves as the Director of HKUST’s Nanomanufacturing Center. With over 500 internationally published papers and more than 20 US patents in GaN-based electronic device technology, he previously conducted R&D on III-V high-speed devices at Japan’s NTT LSI Laboratory and Agilent Technologies in the USA.

Sun Peng（孙鹏）

Sun Peng, President of Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (XMC), has long been engaged in integrated circuit technology R&D and corporate management, participating in multiple national-level science and technology projects. His honors include the Outstanding Award of the China Patent Award, Hubei Provincial Patent Gold Award, and First-Class Prize of the Hubei Provincial Science and Technology Progress Award.

Martin Kuball

Martin Kuball, Royal Academy of Engineering Chair in Emerging Technologies and Fellow of IEEE, MRS, SPIE, IET, and IoP, is a Royal Society Merit Award recipient. He leads the development and application of novel techniques for analyzing temperature, thermal/electrical conductivity, and traps in microwave/power electronic semiconductors, particularly wide/ultra-wide bandgap materials like GaN, Ga₂O₃, SiC, and diamond.

Ryo Takigawa

Ryo Takigawa received the Ph.D. degree from the University of Tokyo, and currently is an Associate Professor at Kyushu University. He was a Visiting Associate Professor at imec from 2023 to 2024. His research interests include heterogeneous integration and advanced packaging based on low-temperature bonding for future photonics and electronics systems.

Eiji Higurashi

Eiji Higurashi, Professor at Department of Electronic Engineering, Tohoku University. He has been serving as the president of the Japan Institute of Electronics Packaging (JIEP) since May 2025 and a 2024-2026 elected member of the Board of Governors of the IEEE Electronics Packaging Society (EPS). His current research interests include heterogeneous integration based on low-temperature bonding and its applications in future electronic devices.