2025 China International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2025 Satellite in China) will be held in Aug. 03 -Aug. 04, 2025, in Tianjin-city, China.

The LTB-3D is a premier conference series sponsored by General Incorporated Non-profit Association - Institute for Advanced Micro-System Integration (IMSI), technically cosponsored by The Electrochemical Society and The IEEE EPS Japan Chapter. This workshop will be held for the first time in China in 2025, which will promote international semiconductor integration technology cooperation and exchange, as well as the development of China's integrated circuit industry and New Quality Productive Forces. LTB-3D 2025 Satellite in China is also sponsored by the Institute of Microelectronics of the Chinese Academy of Sciences, Xidian University, Chinese Institute of Electronics, China Electronic Materials Industry Association and iSABers Group Co., Ltd.

The workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB) and atomic diffusion bonding (ADB), which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems. These bonding technologies have been already used for the volume production and have potential applications in wide range of manufacturing industries. This workshop will be held as a single-track seminar to provide a compact forum for close and deep discussion of all aspects of low temperature bonding technologies – the latest technologies and applications, as well as business opportunities.